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• IC components
for compact and slim
electronic products
are usually limited
by available space and
height. A ceramic heat
sink not only adapts
to these two factors
but also eases the design
and applies a cooling
structure of electronic
products.
• The entirely
new material structure
of a ceramic heat sink
moves heat by air circulation
(without external force)
through the embedded
radiation microporous
ceramic material such
that the accompanying
IC components can operate
continuously in a given
temperature environment.
• A ceramic
heat sink is non-electrical
conductive, humidity
and dust proof by its
special material nature.
With a long life span
and simple assembly
process (simply paste
it to the surface of
any IC component) a
ceramic heat sink saves
not only assembly time
but also material and
labor costs.
•
Ceramic heat sinks are
now adopted by IC of
power under 10W while
specially designed ones
are also available for
high-watt ICs. They
are both ROHS and REACH
compliant green material.
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